INSP – Features

  • Review data from different data sources in one single system with consistent criteria.
  • Highly parallel, automated defect analysis.
  • Compare pattern defects on wafer and reticle.
  • Signature and adder comparison to previous scans.
  • Monitor specific defects.
  • Defect signature detection (e. g. pellicle frame shadow, false readings).
  • Perform equipment specific defect transformations (size binning, position, …).
  • Inspection result data correction based on “golden” results.
  • Check printability again only if a defect had changed.
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  • Screenshot of RIM GUI - Reticle Inspection Management
    RIM GUI - Reticle Inspection Management

    Screenshot of Defect Image Preview
    Defect Image Preview