INSP – Inspection Management for Reticles

INSP – Features

• Review data from different data sources in one single system with consistent criteria.
• Highly parallel, automated defect analysis.
• Compare pattern defects on wafer and reticle.
• Signature and adder comparison to previous scans.
• Monitor specific defects.
• Defect signature detection (e. g. pellicle frame shadow, false readings).
• Perform equipment specific defect transformations (size binning, position, …).
• Inspection result data correction based on “golden” results.
• Check printability again only if a defect had changed.