INSP – Features
- Review data from different data sources in one single system with consistent criteria.
- Highly parallel, automated defect analysis.
- Compare pattern defects on wafer and reticle.
- Signature and adder comparison to previous scans.
- Monitor specific defects.
- Defect signature detection (e. g. pellicle frame shadow, false readings).
- Perform equipment specific defect transformations (size binning, position, …).
- Inspection result data correction based on “golden” results.
- Check printability again only if a defect had changed.
RIM GUI - Reticle Inspection Management
Defect Image Preview